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Failure Analysis In Depth BGA Analysis and Cross-Section. Problem: Determine the cause of voids that appear in BGA balls that contain a microvia beneath them. Analysis: X-ray is used to identify the quality of the solder joints and key areas of interest for the cross section analysis. During the x-ray analysis, other anomalies were noticed as well. Electronics Failure Analysis - National Technical Systems Electronics Failure Analysis (F/A) NTS electronics failure analysis capabilities can be utilized to improve yield, determine root cause of failure, extrapolate life expectancy and improve reliability, and increase performance on integrated circuits (ICs), printed circuit boards (PCBs), and passive surface mount devices as well as materials and assemblies.